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How to Select Material for Your PCBs Based on Cost and Reliability Considerations
Material plays a core role in PCB since it carries its leading functions and properties. And, PCB material allows PCBs to conform to requirement set by products or projects. It is beneficial to reduce cost and improve products' reliability when optimal material is selected.
How to Select Material for Your PCBs from Cost and Reliability Considerations
Material, usually substrate material as far as PCB (Printed Circuit Board) is concerned, plays a core role in PCB since it carries its leading functions and properties. Besides, PCB material allows PCBs to conform to some high and special requirement set by the products or projects they’ll work for. Furthermore, it is beneficial to reduce cost and improve products’ reliability when optimal material is selected.
Elements to be Considered in PCB Material Selection
• Glass Transition Temperature (Tg)
Tg refers to the temperature at which material is converted into glass state. Standard Tg stays above 130℃ while high Tg above 170℃ and mid Tg above 150℃.
When it comes to material for PCBs, high Tg should be picked, which should be higher than the working temperature current runs.
• Coefficient of Thermal Expansion (CTE)
As the temperature of substance rises, substance will suffer from expansion or shrinking. When it comes to PCB fabrication, since CTEs in X, Y and thickness are different, PCB will tend to become deformed. Furthermore, plated hole may suffer from breakage or components will get damaged. Therefore, CTE of substrate material should be sufficiently low.
• Heat Resistance
PCB is required to be heat resistant. Generally speaking, PCBs should feature heat resistance of 250℃/50s, which also works on material.
PCB is required to feature excellent flatness. As far as SMT assembly is concerned, PCB is required to feature warpage lower than 0.0075mm/mm.
• Electrical Performance
High-frequency circuits call for PCB material with high dielectric constant and low dielectric loss. Besides, insulation resistance, dielectric strength and Arc resistance should be compatible with product requirement.
Correlation between PCB Material Selection and Product or Industry
PCB material selection plays a decisive role in contributing to product reliability and is also determined by industry particularity and requirement.
Commonly-used electronic products call for FR4 epoxy fiber glass substrate. After all, the products don’t call for special requirement on flexibility, temperature and density.
Electronic products calling for higher requirement on environmental temperature or flexibility, polyimide glass fiber substrate is applied. For high frequency, PTFE glass fiber substrate should be applied. For PCBs calling for higher requirement on thermal dissipation, metal base substrate should be used.
Classification of PCB Substrate Material
Copper Clad Laminate (CCL) is most commonly used as PCB substrate material. CCL is usually composed by copper foil, resin and base material and also covers a couple of categories.
• Rigid CCL
a. Paper-Based Phenolic CCL
Paper-based phenolic CCL has the longest history, containing classes of FR2, FR1, XXXPC, XX, XXP, X, XP, XPC etc. It features such low cost that it is massively applied in consumer electronics like audio or video and single-side PCBs account for the most.
b. Paper-Based Epoxy CCL
Paper-based epoxy CCL is massively applied in TV, PC, printer, calculator, telecommunication and power substrate. Besides, it is also used in through-hole PCB used for consumer electronics.
c. Paper-Based Polymer CCL
Paper-based polymer CCL is anti-CAF and features high-quality tone, so it is mainly applied in color TVs or stereo. It is created in Japan but is stopped from being manufactured later.
d. Fiberglass Epoxy CCL
Due to its reliability, fiberglass epoxy CCL is most massively applied in CPU, OA equipment, telecommunication and medical care products. Moreover, owing to its electric insulativity, heat resistance, dimensional stability, wet resistance and chemical resistance, fiberglass epoxy CCL is largely used in double-sided PCBs containing through holes. With the tendency of high density of PCBs, fiberglass epoxy CCL is also used as material in multiple-layer PCBs as core material and prepreg etc.
e. Composite CCL
The resin in composite CCL mainly comes in epoxy resin and polyester resin. Composite CCL primarily works on single-sided PCBs and through-hole PCBs. CEM-3 composite CCL is commonly used in some certain industries due to its reliability, heat resistance, moisture resistance, and dimensional stability. Moreover, composite CCL works more suitably for SMT assembly on thin PCB boards.
What Is FR4?
FR4 indicates the grade of a type of fire resistant material that is capable of automatically going out after suffering from fire. Therefore, FR4 is not the name of material while it indicates a grade of material.
FR4 material can be classified into a couple of classifications.
FR4 A1 mainly serves electronic products belonging to fields of military service, telecommunication, digital circuits, industrial instrument and automobile owing to its high quality and performance.
FR4 A2 works for the largest extent of industries because all its features are compatible with the requirement of ordinary industries, including PC, instrument, home appliances and ordinary electronic products. Furthermore, it leads to low cost, which is one of its advantages over other types of material.
FR4 A3 is capable of meeting demands and requirement of ordinary electronics such as toys, calculators, game machines and other common electronic products. Compatible with product functions, FR4 A3 leads to extremely low price.
High-TG PCBs High Temperature PCB fr4 MaterialHigh-TG PCB:
The Glass Transition Temperature (Tg) is one of the most important properties of any epoxy and is the temperature region where the polymer transitions from hard, glassy material to a soft, rubbery material.
Circuit board material must flame-resistant, it can’t be burned at a certain temperature and only be softened. The temperature point is called the glass transition temperature (Tg).
The higher Tg point means a higher temperature requirement during lamination. And the boards will be hard and crisp, which will affect the hole and the electrical properties.
Ordinary PCB materials at high temperatures, not only will be softened, deformation, melting and other phenomena, but also the mechanical and electrical properties decline sharply.
General FR4 Tg is 130-140 centigrade, moderate Tg is greater than 150-160 centigrade, High-Tg is greater than 170 degrees.
The higher of Tg, the better the performance of PCB heat resistance, moisture resistance, chemical resistance, stability and other characteristics.
FR4 is a code name for the grade of Epoxy Glass material.
Tg means Glass Transition Temperature.
When the working temperature reaches the melting point, that means the temperature exceeds the Tg value, the status of PCB material will be changed from glassy to liquid, which will affect the function of PCB. And this value is related to the stability of the PCB dimension.
As usual, made with Tg ≥ 170℃ PCB material, which is called a high Tg printed circuit board. With the rapid development of the electronics industry, high Tg material is widely used in computers, communication equipment, precise apparatus, and instruments, etc.
Check PCBWay High-Tg PCB manufacturing capabilities in the following table:
Material Tg140 FR-4,Tg150 FR-4,Tg170 FR-4,Tg150 FR-4 (Halogen-free), Tg170 FR-4 (Halogen-free)
Min. Track/Spacing 2mil
Min. Hole Size 0.15mm
Finished Cooper 0.5-13oz
Board Thickness 0.2-6mm
Surface Finishing HASL lead free,Immersion gold, OSP, Hard Gold,Immersion SIlver,Enepig
Solder Mask Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green
Silkscreen White, Black
Via Process Tenting Vias,Plugged Vias,Vias not covered
Testing Fly Probe Testing (Free) and A.O.I. testing
Build time 7-10 days
Lead time 2-3 days
Product Data sheet： Download(PDF) IT-180A
Product Data sheet： Download(PDF) TU768
Product Data sheet： Download(PDF) S1000-2 S1000-2B
Product Data sheet： Download(PDF) S1170G S1170GB
More information please check here:
High-Tg PCB Instant Quote
This message here is only a suggestion supplement to the above content, and does not for trading operations such as orders. If you have any urgent questions or order issues, please contact your sales rep.
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6oz Heavy Copper PCB/electronic Power Board/high Tg PCB
Product detailsItemManufacture CapabilityMaterialFR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-1, Aluminium, Meta
6oz heavy copper PCB/electronic power board/high Tg PCB
Product detailsItemManufacture CapabilityMaterialFR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-1, Aluminium, Metal basedLayer No.1-16Finished Board thickness0.2 mm-3.8mm\'(8 mil-150 mil) Board Thickness Tolerance±10%Cooper thickness0.5 OZ-6OZ (18 um-210um)Copper Plating Hole18-40
SEND EMAIL TO US
FEATURED PRODUCTSProduct detailsItemManufacture Capability
FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-1, Aluminium, Metal based
Layer No. 1-16
Finished Board thickness
0.2 mm-3.8mm'(8 mil-150 mil)
Board Thickness Tolerance
±10% Cooper thickness
0.5 OZ-6OZ (18 um-210um)
Copper Plating Hole 18-40 um Impedance Control ±10% Warp&Twist 0.70% Peelable
Min Trace Width (a) 0.075mm (3mil) Min Space Width (b) 0.1mm (4 mil) Min Annular Ring 0.1mm (4 mil) SMD Pitch (a) 0.2 mm(8 mil) BGA Pitch (b) 0.2 mm (8 mil) 0.05mmSolder Mask
Min Solder Mask Dam (a)
0.0635 mm (2.5mil)
Soldermask Clearance (b)
0.1mm (4 mil)
Min SMT Pad spacing (c)
0.1mm (4 mil)
Solder Mask Thickness
Min Hole size (CNC) 0.2 mm (8 mil) Min Punch Hole Size 0.9 mm (35 mil) Hole Size Tol (+/-)
Hole Position Tol ±0.075mmPlating
HASL 2.5um Lead free HASL 2.5um Immersion Gold
Nickel 3-7um Au:1-5u''
Panel Outline Tol (+/-)
CNC: ±0.125mm, Punching: ±0.15mm
Beveling 30°45° Gold Finger angle 15° 30° 45° 60°Certificate
IATF16949,ROHS, ISO9001:2008, SGS, UL certificate,CQC certificatePackaging & Delivery
Packaging Details:Carton Box with Vaccum Anti-static bag inner Delivery.
Delivery Time:2 to 15 days after depositFAQQ1: How do you make sure the quality?
•:Our Product is all 100% tested including Flying Probe Test (for sample), E-test (mass) or AOI.Q2.What do I need to offer for production?
•Quantity, Gerber file and Technic requirements(material,surface finish treatment, copper thickness,board thickness ,...)Q3. What file formats do you accept for production?
•Gerber file: CAM350 RS274X
•PCB file: Protel 99SEQ4.Are my PCB files safe when I submit them to you for manufacturing?
•We respect customer's copyright and will never manufacture PCB for someone else with your files unless we receive written. Permission from you, nor we'll share these files with any other 3rd parties.Q5:What is your minimum order quantity?
• Our MOQ is 1 PCS.Company InformationShenzhen Hongmy Precision Circuit Co., Ltd ,founded in 2007, is a high-tech enterprise which specializes in developing, manufacturing and marketing of Printed Circuit Board (PCB). Our factory is located in the beautiful city: Shenzhen, near to Hong Kong, Dongguan, Guangzhou, Huizhou and so on, which is convenient for your visiting.
Since the establishment of the company, we are committed to become a leading company of PCB system solutions. With 7000 square meters' of workshop area and over 300 employees, We offer a wide range of PCBs, such as single-sided, double-sided, multi-layer, high frequency, MCPCB, and so on.
Our customers are from over world in various industries, including Computer, Automotive, Medical Equpment,Digital Appliance,Home control, Consumer products, Telecom, etc.We believe Quality Always Comes First !Our manufacturing and quality control processes are ISO 9001:2008 certified and conform to IPC-A600(PCB) standards. All our PCB are UL certified and RoHS compliant.
Our eternal and ultimate target is"Create higher value and offer better solutions for our customers all the time",
Our orientation is clear, "Focus on prototypes and low to medium volume business "
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